摘要
通过分析影响非工作期微电路可靠性的主要因素，采用大量的现场和试验数据进行归一化-线性化-回归分析，研究各主要影响因素与微电路非工作期失效率的定量关系，进而建立可靠性预计模型，该模型预计的失效率与电子设备非工作现场失效率比较，初步验证结果良好。
The main factors effecting on microcircuit reliability during nonoperating periods, such as quality control standard, environment, complexity, package, temperature etc., are studied and analysed. A large amount of field and laboratory data is used in a statistics procedure to establish the reliability prediction model. The prediction failure rate is consistent as compared with the nonfield failure rate.
