摘要
通过对硫代硫酸盐、丁二酰亚胺、碘化物、乙内酰脲、亚硫酸盐以及其它无氰镀银体系的分析,总结了当前无氰镀银工艺的技术特点及存在的问题,并阐述了无氰镀银技术的发展历程和研究现状。同时,基于国家目前的经济发展战略,对无氰镀银技术的前景予以了展望。
Technical characteristics and existing problems of cyanide-free silver plating technology were summarized through the analysis of cyanide-free silver plating systems of thiosulfate, succinimide, iodide, hydantoin, sulfite and others. Development course and research status quo of the cyanide-free silver plating technique were elaborated. In the meantime, the development future of the cyanide-free silver plating technique is prospected based on current economy development strategy of our country.
出处
《电镀与精饰》
CAS
2007年第5期12-16,共5页
Plating & Finishing
关键词
无氰镀银
发展
研究现状
环境保护
cyanide-free silver plating
development
research status quo
environment protection
