积层电路板制造用光敏预聚物的合成及应用研究

Synthesis and Application of Photosensitive Prepolymer for Building-up Multilayer Circuit Board

用丙烯酸对酚醛环氧树脂进行改性,以使其具有感光性。考察温度及催化剂用量对反应的影响,并介绍积层电路板制造用液态感光成像油墨的配方和制作工艺,分析以合成的光敏预聚物为主体配制的油墨的感光性。结果发现,合适的反应温度为90℃,反应5h,转化率达91.83%;以十六烷基三甲基溴化铵为催化剂,其质量分数以1.5%为宜;以自制的光敏预聚物配制的油墨,在曝光20s时,双键的转化率可达80%以上。

Phenolic epoxy resin was modified with acrylic acid for taking on photosensitivity. The effects of temperature and catalyst quantity on the reaction were investigated. The formulation and the manufacturing process of the liquid photo-image ink for building-up multilayer circuit board are introduced. The photosensitivity of the ink prepared with photosensitive prepolymer as main raw material is analyzed. It is showed that the appropriate reaction temperature is 90℃ and the percent conversion reaches 91.83% when the reaction time is 5 h. The appropriate mass fraction of the catalyst is 1.5% if the catalyst is hexadecyl trimethyi ammonium bromide. After exposuring 20s, the percent conversion of double bond in the ink prepared with self-made photosensitive prepolymer can exceed 80%.