摘要
对用于封装的BaCO3基低温共烧陶瓷基板LTCC材料进行了研究,包括组分配制以及陶瓷制备工艺研究。对烧结后陶瓷的部分热性能以及力学性能进行了测试。结果表明:BaCO3基低温共烧陶瓷较为致密的密度在3.8～4.2g/cm3,在900℃烧结的陶瓷机械形变较小。
The components＇ preparation and the process of packaging used for the BaCO3-based low temperature co-sintering ceramic substrate material were studied. Part of sintered ceramic thermal performance and mechanical properties were tested. Results indicate the range of density is 3.8-4.2 g/cm^3. The value of mechanical deformation of the ceramic sintering at 900 ℃ is less than the others.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第9期1-3,共3页
Electronic Components And Materials
关键词
无机非金属材料
BaCO3基低温共烧陶瓷
玻璃材料
主晶相材料
液相烧结
non-metallic inorganic material
BaCO3-based low temperature co-sintering ceramic
glass material
primary crystalline phase material
liquid phase sintering
