摘要
将MgTiO3微波介质陶瓷与Ni-Zn-Cu铁氧体进行低温共烧实验,研究了两种材料的低温烧结特性,结果表明,添加适量的Bi2O3能将复合材料的烧结温度降至900~920℃,并且使得烧结更加致密化。实验证明两种材料之间没有发生化学反应,各自保持了原有的物相,二者具有良好的化学相容性。该复合材料既具有铁电性又具有铁磁性,并且能满足低温共烧工艺的要求,有很好的应用前景。
The composites were prepared by low temperature co-firing MgTiO3 microwave dielectric ceramic and Ni-Zn-Cu ferrite. The co-firing properties were investigated. It is found that Bi203 can reduce sintering temperature to 900~ 920 ℃ and improve density. The results show that there is no chemical reaction between MgTiO3 microwave dielectric ceramic and Ni-Zn-Cu ferrite and the two still keep their own phase structures.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第9期4-6,共3页
Electronic Components And Materials
关键词
无机非金属材料
微波介质陶瓷
铁氧体
低温共烧
烧结温度
non-metallic inorganic material
microwave dielectric ceramic
ferrite
low temperature co-firing
sintering temperature