摘要
针对片状压电陶瓷谐振器封装过程中出现的密封性和振子断裂等问题进行了分析研究,通过在固化工序中降低温度梯度、环氧树脂中掺入晶态二氧化硅等方法减少作用于振子上的应力,解决了振子断裂和密封性等技术难点,使片状陶瓷谐振器的封装可靠性提高到95%以上。
The problems on sealability and break strength of the resonator oscillator were investigated, which appeared in the sealing procedure. By reducing the temperature gradient in solidifying procedure or doping crystalline-state silicon dioxide into epoxy resin, these problems of the oscillator break were resolved, and the sealability of laminated ceramic resonator is increased above 95 %.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第9期68-70,共3页
Electronic Components And Materials
关键词
无机非金属材料
二氧化硅
陶瓷谐振器
封装
non-metallic inorganic material
silicon dioxide
ceramic resonators
sealing and packing
