喷射成形70Si30Al电子封装材料致密化处理及组织性能研究

Research on Densification Processing,Microstructure and Properties of Spray-Formed 70Si30Al Alloys Used for Electronic Packaging

利用喷射成形技术制备了70Si30Al合金沉积坯件。对沉积坯件进行了差示扫描热分析,研究了热压温度对致密化效果的影响,在560,570,580,590℃下保温0.5h后220MPa保压2h进行了热压致密化处理;研究了压强对致密化效果的影响,在570℃保温0.5h后160,220,300,410MPa保压2h进行了热压致密化处理,测试了材料的密度、热膨胀系数和热导率。结果表明:喷射成形70Si30Al合金在566.4℃时有熔化相出现,理想的致密化工艺参数为570℃保温0.5h后220～300MPa保压2h,此工艺致密化处理后的喷射成形70Si30Al的密度为2.421×103kg.m-3,25℃时的热膨胀系数为6.9×10-6K-1,50℃时的热导率为118K.(W.m-1.K-1)-1。

70Si30Al alloy was synthesized by the spray atomization and deposition technique.The densification of the alloy was applied,which involved holding at different temperatures（560,570,580,590 ℃）for 0.5 h and compressing for 2 h under 220 MPa,and the effect of hot pressing temperature on the densification of the alloy was investigated by using DSC analysis.The densification of the alloy was applied,which involved holding at 570 ℃ for 0.5 h and compressing for 2 h under different pressures（160,220,300,410 MPa）,and the effect of pressure on the densification of the alloy was studied.The density,coefficient of thermal expansion and thermal conductivity of the alloy were tested.The results indicated that spray formed 70Si30Al alloy started to remelt at about 566.4 ℃,and the parameters of hot pressing for the alloys＇ densification were determined as below：holding at 570 ℃ for 0.5 h plus pressing for 2 h under 220～300 MPa.After densification treatment,spay formed 70Si30Al alloy exhibited attractive properties,i.e.low density（2.421×10^3 kg·m^-3）,low CTE（6.9×10^-6 K^-1）and high thermal conductivity（118 K·（W·m^-1·K^-1）^-1）.