覆铜板在NaCl溶液中的腐蚀电化学行为

Electrochemical Corrosion Behavior of Copper Clad Laminate in NaC1 Solution

应用线性极化、循环伏安(CV)及电化学阻抗谱(EIS)等电化学方法对覆铜板(CCL)和纯铜的腐蚀电化学行为进行了研究和比较.结果表明,覆铜板的耐蚀性弱于纯铜,其阳极溶解过程与纯铜有所不同;在较低电位下,CCL以铜的氯化络合物的形式溶解,CuCl_2^-的扩散为该过程的控制步骤;随着电位的升高,腐蚀产物CuCl在电极表面形成疏松多孔的膜,Cl^-在膜中的传输成为溶解过程的控制步骤.电极表面CuCl膜的消长过程是产生感抗弧的主要原因.

Comparing with pure copper,the corrosion behavior of copper clad laminate（CCL）in NaCl solution was studied by using linear polarization,cyclic voltammetry（CV）and electrochemical impedance spectroscopy（EIS）.It was shown that CCL had a different corrosion behavior and showed a lower corrosion resistance compared with the pure copper.At low polarization potential,CCL dissolves through the formation of CuCl2^-,which may be a determined step in the anodic process.And when the polarization potential increased,a porous film containing CuCl formed on the CCL surface,and the transportation of Cl^- in the film became the controlling step in the corrosion process.An inductive loop at low frequency was observed in the EIS measurement,which was attributed to the modulation of CuCl film due to the competition between dissolution and growth processes on CCL surface.