摘要
针对采用激光二极管和接收器检测晶圆缺口时存在的一次检测成功率低、检测时间长和机械结构复杂等缺点,为了缩短单片晶圆检测时间,提高晶圆搬运机的效率,本文提出了一种基于线阵CCD的检测方法。通过实验对比证明,该方法与基于激光二极管的检测方法相比,能够缩短一半以上的检测时间,消除了采用激光二极管进行检测时,因晶圆中心和真空吸盘中心存在偏差而引起的检测失败,一次检测成功率达95%以上,同时该方法只需要一个旋转吸盘,简化了机械结构。
There are some disadvantages of the method, based on laser diode and receiver, to detect the wafer notch, such as low mission success rate,long detecting time, complex machine structure and so on. In order to shorten the detecting time and improve the efficiency of the wafer transfer, a new method of detecting wafer notch is introduced, which is based on linear CCD. Compared to the method based on laser diode through experiments, the new method just needs half the time to detect a piece of wafer, avoids the detection failure which is caused by the deviation of canter point between the wafer and vacuum sucking disc, and then the mission success rate is more than 95%. At the same time, the new method just needs a rotary disc,which simplifies the machine structure.
出处
《电子测量技术》
2007年第8期133-136,共4页
Electronic Measurement Technology