石墨表面化学镀铜新方法

A Novel Processing Technology of FJectroiess Copper Plating on Graphite Powder

在石、墨粉表面预包覆一层铜可以大大提高铜．石墨复合材料的力学和电学性能。研究了一种在石墨粉表面化学镀铜的新方法——利用还原铁粉作还原剂的化学镀法。通过大量试验和差热分析仪确定了最佳镀覆工艺条件，并用扫描电镜分析了镀覆效果。研究表明，使用十二烷基磺酸钠、十二烷基苯磺酸钠和磷酸钠混合表面活性剂对石、墨粉清洗、润湿和活化预处理后，用还原铁粉作还原剂、饱和硫酸铜溶液作镀液，在pH值为1．5～2．0、40～60℃温度下搅拌施镀，C6H5N3钝化后在红外干燥箱内48～50℃干燥可得镀覆效果良好的镀铜石、墨粉末。该方法解决了常用铁粉作还原剂时出现的问题。

Graphite with pre-coated copper can improve the mechanical and electronic properties of the composite materials greatly. A novel processing technology of electroless copper plating on graphite powder u-sing iron as reducing agent was evaluated. The optimum plating conditions were acquired through comparing experiments and by differential thermal analysis. The plated samples were analyzed by SEM. The processing technology included following steps; the graphite powders were washed, wetted and activated by CH3(CH2)11SO3Na, CH3(CH2)4CH(C6H4SO3Na) (CH2)5CH3 and Na3PO4 complex surfactants in the pretreatment stage, then electroless copper was plated on graphite powder using iron as reducing agent and saturated CuSO4 solute as electroless solution with pH of 1.5-2.0 at 40-60 ℃ , finally the well plated graphite powders were obtained after being dried under 48-50 ℃ in the infrared ray drying cabinet after C6H5 N3 passivated. The disadvantages occurred in the other processing technology using iron as reducing agent was avoided in this technology.