Au-20.1Ag-2.5Si-2.5Ge新型中温钎料的组织与性能

Microstructure and properties of new type Au-20.1Ag-2.5Si-2.5Ge medium-temperature solder

选择成分（质量分数，％）为Au-20．1Ag-2．5Si-2．5Ge的中温钎料合金，采用中频感应真空熔炼法制备钎料合金铸锭，分别利用DTA、SEM对钎料合金的熔点及显微组织进行分析，并初步研究钎料与Ni的润湿性。结果表明，钎料合金的熔化温度区间为451．36-506．49℃；钎料合金形成了α＋β共晶组织，由于Si、Ge同时加入，共晶组织变质为细小分散的共晶体；钎料合金具备优良的可加工性以及与Ni具有良好的润湿性，且在焊接界面钎料合金已与Ni合金化形成金属间化合物。

Au-20.1Ag-2.SSi-2.SGe （mass fraction, %） medium-temperature solder was selected to prepare the casting alloy by the vacuum medium-frequency induction melting method, the melting point and the microstructure were studied by DTA and SEM, and the wettability of the solder alloy with Ni was tested tentatively. The results show that, the melting temperature of the solder alloy is in the range of 451.36-506.49 ℃; α＋β eutectic structures form in the solder alloy; because of the addition of Si and Ge, the eutectic structures are modified to be much finer and dispersive Structures; the solder alloy has good machinability and good wettability with Ni, the solder alloy is alloyed with Ni by forming intermetalics in the welding interface.