摘要
采用Moldflow MPI6.0软件对带有金属嵌件的手机外壳进行变形分析,通过优化嵌件的设计,可有效地减小手机外壳的变形,为用户提供最佳的设计方案。
Moldflow MPI 6.0 software was applied to analyse the warpage of the mobile phone housing with the metal insert. The warpage of the mobile phone housing was reduced effectively by optimizing the design of the metal insert, which could provide users with optimum design proposal.
出处
《塑料工业》
CAS
CSCD
北大核心
2007年第9期35-37,共3页
China Plastics Industry
关键词
模流分析
嵌件
手机外壳
变形
Moldflow Analysis
Insert
Mobile Phone Housing
Warpage