镍铬薄膜电阻的制备和热处理分析

Preparation And Heat Treatment Analysis Of NiCr Alloy Films Resistance

在采用磁控溅射方法制作用于集成电路的镍铬薄膜电阻过程中,发现在对薄膜热处理时薄膜的电阻特性发生了有规律的变化,这种变化不是单纯的线形增大或减小。针对这种现象,我们经过分析认为,由于金属薄膜的电阻率不同于块金属的电阻率,已不是定值,它与金属膜厚有着一定的关系,而热处理所产生的凝聚效应、氧化效应和稳态效应对不同厚度的薄膜电阻率的影响程度是不一样的,因此电阻经处理后的变化值最终表现出不同的变化趋势。这一现象的发现对我们今后在集成电路镍铬合金薄膜电阻的设计优化方面具有较高的参考意义。

In the process of manufacturing Ni-Cr alloy film resistances of IC by using magnetronic sputtering , the film resistive property has been found having a regular change after annealing process. This change isn＇t simply linear to increase or decrease .This phenomenon is analyzed that the film resistivity which differs from body resistivity is related to film thickness. The condensation, oxidation and stabilization effects occurred by annealing have different influences on the film resistivity with various thicknesses, so the changes of film resistances through annealing show different tendencies eventually. The research of this phenomenon has a greater significance for the manufacturing and optimization of Ni-Cr film resistances of IC.