摘要
将高压MOSFETs器件集成到低压CMOS数字和模拟电路中的应用越来越频繁。文章参考了Parpia提出结构,将高压NMOS、PMOS器件制作在商用3.3V/5V 0.5μmN-阱CMOS工艺中,没有增加任何工艺步骤,也没有较复杂BiCMOS工艺中用到的P-阱、P+、N+埋层,使用了PT注入。通过对设计结构的PCM测试,可以得到高压大电流的NMOS管BVdssn>23V~25V,P管击穿BVdssp>19V。同时,文章也提供了高压器件的设计思路和结果描述。
There has been growing interest in developing high-voltage MOSFETs devices that can be integrated with low-voltage CMOS digital and analog circuits. In this paper, high-voltage n- and p-type MOSFETs were fabricated in a commercial 3.3V/5V 0.5μm N-well CMOS process without adding any process steps, based on the structures proposed by Parpia, et al. In the absence of a P-well, P+ and N+ buried layers which are available only in a more complex BiCMOS process, N-well and P-channel stop were used. High current and high-voltage transistors with breakdown voltages between 23V-35V for the NMOS transistors with different layout parameters and 19V for the PMOS transistors were achieved. This paper also presents the design considerations and characterization results for these high-voltage devices.
出处
《电子与封装》
2007年第9期22-25,共4页
Electronics & Packaging