期刊文献+

简析影响PIP制程中良品率的主要因素及后果

Analasys Principal Factors and Aftereffect of Influence Good Quality in PIP
下载PDF
导出
摘要 PIP制程逐渐成为电子行业焊接不规则零件的主流.但PIP制程仍然会发生大量的制程的不良现象,从而降低了产品的良品率.本文列举了PIP生产过程中引起的多种与质量有关的不良现象及产生的原因,并对这些不良因素产生后果进行简单的分析,同时以生产中实例图片来补充说明PIP制程中的不良因素对良品率的影响。 Pip process is becoming mainstream of soldering irregular component, but it still exists so many badnesses as to decrease good qualities of product in pip. The article details many bad phenomena and causes which are corresponding to quality and analyses simply caused aftereffect. Meanwhile, many actual examples illustrate the affection of good quality on account of bad factors in pip.
出处 《电子与封装》 2007年第9期40-42,共3页 Electronics & Packaging
关键词 PIP制程 回流焊 波峰焊 良品率 不良因素 PIP reflow wave solder good quality badness
  • 相关文献

参考文献3

  • 1Bill Barthel.Through Hole Connector Soldering with Sol-der Paste Reflow[].Journal of SMT.1995
  • 2Joe Belmonte,Phil Zarrow.reflow Soldering of Through-Hole Components[].Future CircuitsQtrssue.1997
  • 3Joe Belmonte,Phil Zarrow.Advanced surface-mount manufacturing methods[].Circuits Assembly.1996

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部