期刊文献+

双端面磨床加工滚子端面的磨削区特性分析 被引量:3

Analyzing characteristics of grinding zone during machining roller end with double-ended grinder
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摘要 从理论上分析了采用双端面磨床加工滚子端面时磨削区的变化规律以及影响因素,给出了磨削量计算公式。 The change law and influence factors of grinding area during machining roller end were analyzed theoretically. The calculation formula on grinding tolerance was given.
出处 《哈尔滨轴承》 2007年第3期10-12,共3页 Journal of Harbin Bearing
关键词 双端面磨床 滚子 磨削区 double-ended grinder roller grinding zone
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同被引文献19

  • 1张国兴.双端面磨床砂轮修整后的形貌评定[J].轴承,1993(8):10-14. 被引量:2
  • 2HuHuiqing.GRINDING OF DOUBLE DISC GRINDING MACHINE[J].Chinese Journal of Mechanical Engineering,2005,18(1):1-4. 被引量:4
  • 3田业冰,金洙吉,康仁科,郭东明.硅片自旋转磨削的运动几何学分析[J].中国机械工程,2005,16(20):1798-1801. 被引量:15
  • 4Srivastava E.Control Strategy for Multipass RoboticGrinding [J].International Journal of RoboticsAutomation, 1995,10(3):114-119.
  • 5Srivastava E.Optimal Planning of an AdaptivelyControlled Robotic Disk Grinding Process[J].Inter-national Journal of Machine Tools and Manufacture,1993,33(6):809-825.
  • 6Hu Huiqing.Grinding of Doube Disc Grinding Ma-chine[J], Chinese Journal of Mechanical Engineer-ing,2005,18(1):124-127.
  • 7许世雄,王洪.一种高精度双端面磨削加工方法:中国,201106278922.0[P].2011-06-13.
  • 8马尔金S.磨削技术原理与应用[M].沈阳:东北大学出版社,2002.
  • 9PIETSCH G J, KERSTAN M. Understanding simultaneous double disk grinding:opearation and material removal kine- matics in silicon wafer planarization[ J]. Precision Engineer- ing,2005,29(2) :189 - 196.
  • 10ZARUDI I, HAN B S. Deformation and material removal rate in polishing silicon wafers [ J ]. Journal of Materials Process- ing Technology, 2003 ( 140 ) : 641 - 645.

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