尼龙6表面金属(Cu)化膜材料制备及性能

Studies on the Preparation and Properties of Metallized(Cu) Films of Nylon6 Surface

用化学还原法制得了尼龙6表面金属(Cu)化膜材料.研究了这种膜材料的电性能、化学还原条件对电性能的影响,以及8mm电磁波的屏蔽性能和9μm处的法向辐射性能,并用光电子能谱和扫瞄电子显微镜对其表面及形貌进行了表征,简单地讨论了这种膜材料的导电机制.

Metallized(Cu) films were obtained by the reduction of CuCl_2 / Nylon6chelare films with a reducing agent.For those films the condution, the effects ofreducing conditions on the conductivity, the shielding performance against electro-magnetic radation at 8mm, and the normal emissivity at 9μm of the film wereinvestigated. The surface and morphology of metallized(Cu) films were exhibitedby means of ESCA analyses and SEM obserations. The conductive mechanism ofthe film was also briefly discussed.