摘要
研究了快速凝固Cu-0.36Cr-0.23Sn-0.15Zn合金的时效处理,发现在不降低快速凝固合金电导率的前提下,可使其显微硬度比常规固溶合金提高35%。快速凝固合金强度和硬度的提高主要是弥散析出强化、细晶强化、固溶强化以及晶体缺陷强化共同作用的结果。结果表明,该合金快速凝固后,在500℃时效时,可以获得较高的显微硬度,其峰值可达159HV;而在550℃时效时,可以获得较高的电导率,时效30min可达68.72%IACS。试验结果还表明,快速凝固合金的析出相对电子的散射作用要大于常规固溶,使时效后期快速凝固合金的电导率略小于常规固溶合金的电导率。
The aging treatment of rapidly solidified Cu-0.36Cr-0.23Sn-0.15Zn alloy was studied. It was found that,the micro-hardness of rapidly solidified alloy was 35% higher than that of routine solid-solution alloy while the electric conductivity was not decreased. The increase of strength and micro-hardness of rapidly solidified alloy can be attributed to precipitation strengthening, solid- solution strengthening, fine crystal strengthening and crystal defects strengthening. Experimental results show that, after rapid solidification, the alloy can obtain higher micro-hardness aged at 50032. Its maximum is 159 HV, while its higher electric conductivity is obtained when aged at 55032 for 30min, which is 68.72% IACS. The results also show that the diffraction of rapid solidification alloy＇s precipitates on flee electrons is stronger than that of routine solid-solution alloy. Consequently, the electrical conductivity of rapid solidification alloy is slightly lower than that of routine solid-solution alloy.
出处
《热加工工艺》
CSCD
北大核心
2007年第18期7-9,13,共4页
Hot Working Technology
基金
河南省重大科技攻关基金资助项目(0122021300)
