摘要
本文采用现代光测力学的云纹干涉法,对铜-可伐焊接件热应变问题进行了实验研究,确定了焊层的热应变特征,结果表明:由于热膨胀系数不匹配、焊层存在复杂的应力状态,它不仅受到焊板材料对它的剪切作用,而且受到纵向拉伸、挤压作用。
The thermal strain of bimetal soldering joint (Cu and Kovar) is analysed with moire interferometry method. The thermal strain distribution along the soft solder (62Sn 36Pb 2Ag) is determined. It is shown from the results that there exists in the solder layer a complicated state of thermal strain. This is important for understanding the thermal fatigue failure mechanism in electronic package.
出处
《实验力学》
CSCD
北大核心
1997年第2期241-247,共7页
Journal of Experimental Mechanics
关键词
云纹干涉
焊接
热膨胀
热变形
moire interferometry, thermal expassion, solder joint.