摘要
采用粉末冶金方法,以SiC、SiO2、Al2O3和AlN等纳米颗粒为增强相,制备出Cu/SiC、Cu/SiO2、Cu/Al2O3和Cu/AlN等铜基纳米复合材料;研究了各增强相的含量对复合材料的显微组织和性能的影响,比较了不同纳米颗粒对铜基复合材料的增强效果。结果表明,Cu基纳米复合材料随增强相质量分数的增加,密度降低,电阻率略有升高,强度和硬度先升高后降低;退火温度曲线表明,复合材料的软化温度都达到700℃以上,远高于纯铜的软化温度(150℃),大大提高了材料的热稳定性;通过比较得知,在质量分数相同时,所采用的各增强相纳米颗粒对铜基体的增强效果相近。
Copper-matrix composites reinforced with nanoparticles of SiC, SiO2 , Al2O3 and AIN were fabricated by powder metallurgy method. The influence of reinforcement particles contents on properties and microstructure of the composites were studied. The results show that density of copper-matrix composites decreases, resistivity increases, whereas bending strength and hardness increase firstly and then drop with increase of the reinfocement contents in the composites. Annealing tests indicates that the softening temperatures of the all composites are above 700℃, which is far higher than that of pure copper（ 150℃）, leading to improvement of elevated temperature stability of these composites. The copper-matrix composites reinforced with the different nanoparticles exhibit similar properties under condition of the same weight fraction.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2007年第5期10-14,共5页
Transactions of Materials and Heat Treatment
基金
安徽省"十五"科技攻关项目(040020392)
合肥市重点科技攻关项目(20051004)
安徽省自然科学基金资助项目(070414180)
关键词
粉末冶金
密度
电阻率
硬度
软化温度
powder metallurgy
density
resistivity
hardness
softening temperature
