SEBS-g-MAH和EP复合增容PA610/PC合金的研究

STUDY OF PA610/PC ALLOY COMPATIBILIZED BY SEBS-g-MAH AND EPOXY

选用SEBS-g-MAH和EP为复合增容剂,采用熔融挤出的方法制备了PA610/PC合金,研究了该合金的力学性能、熔融结晶及微观结构形态。结果表明,当PA610/SEBS-g-MAH(EP)/PC组分比为75/9(2)/25时,合金的冲击强度比不加增容剂时提高了281.4%,断裂伸长率提高了346.0%。而增容剂的加入使合金中PA610的结晶温度升高,结晶速率增大而结晶度降低,由于异相成核作用使结晶发生细化,使得韧性提高、熔点降低。微观结构形态研究表明,在只加入SEBS-g-MAH的PA610/PC合金中,合金断面有很多PC被拔出及余留空洞的现象;在加入EP协同增容后,PC被拔出的现象减少,与PA610基体的界面粘合增强,空洞消失。

Polyamide 610（ PA610）/polycarbonate（PC） blends compatibilized by SEBS-g-MAH and epoxy were prepared by melting extrusion molding. The mechanical properties, melting crystallization behaviors and microscopic morphologies of the prepared alloys were studied. The results showed that the notched lzod impact strength was 381.4% higher than that of alloy without any compatibilizer and the elongation at break was 4.46 times as that of alloy without compatibilizer when the mass ratio of PA610/SEBS-g-MAH （epoxy）/PC was 75/9 （2）/25. The temperature and crystallization rate of PA610 increased and the crystallization degree decreased with the increase of compatibilizer content. The toughness of alloys improved and the melting temperature decreased because of heterogeneous nucleation. The microscopic morphology results showed that the fracture surface of alloys compatibilized by SEBS-g-MAH only had a lot of elongated PC domains and voids ; the voids disappeared and the phase adhesion became stronger when adding epoxy in the above alloys.