摘要
介绍了QFN封装器件的优点,指出了QFN器件常见的组装工艺缺陷类型,分析了QFN器件组装工艺缺陷形成的原因,给出了改善这些工艺缺陷的措施,对组装过程中QFN工艺缺陷的分析与解决有一定的实用意义。
The advantages of QFN package are introduced. Then point out the popular assembly process defects of QFN component. Analyze formation reasons of these process defects of QFN components during SMT assembly. Then troubleshooting solutions for QFN process defects are presented. They will help SMT process engineer analyzing and eliminating QFN process defects.
出处
《电子工艺技术》
2007年第5期261-263,共3页
Electronics Process Technology
关键词
QFN
组装
缺陷
消除
QFN
Assembly
Defects
Elimination
