摘要
目前应用的系统级封装SiP还只是制造商们简单制作的芯片组合体,而今后为了真正普及SiP,还有若干个残留课题,如芯片的测试、多个芯片组合时回路的控制等。叙述SiP技术的现状和将来的展望及课题。
Now SiP （ System - in - Package ） application is only the simple chip assembly, but in order to popularize SiP, there are many projects which must be studied, including inspection, circuits control of many chips assembly and so on. Introduce the pressent situation and development of SiP technology.
出处
《电子工艺技术》
2007年第5期273-275,279,共4页
Electronics Process Technology
