摘要
Wafer pre-aligning system is an important component in IC manufacturing industry.A wafer pre-aligning platform with a CCD sensor is presented in this paper.The centering and notch detecting approaches are extended based on this platform. Least square circle fitting approach is adopted to calculate the center and radius of the wafer, and a formula for calculating the fitting error is derived. An approach called edge variation rate is also proposed to detect the range of wafer notch, and the fiducial is calculated by curve fitting approach. These approaches can improve the accuracy effectively as indicated by experiments.
