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结合垂直通孔分配的层次式三维混合布局算法 被引量：1

Towards Integration of Hierarchical 3D Mixed-Mode Placement and Vertical Via Assignment
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摘要 采用层次式方法,分而治之,减小了电路的设计规模,非常适用于大规模的混合模式布局,并且在布局阶段结合了垂直通孔的分配问题.布局阶段的通孔分配问题不仅使得三维布局问题得以简化,而且为布线做好了准备,减少了后面的调整,是布线阶段垂直通孔分配问题的良好指导.提出了2种垂直通孔分配算法:比较精确的匈牙利近似算法;比较快速的邻域搜索方法.将这2种算法与层次式三维混合模式布局流程紧密结合,有效地解决了三维混合模式布局问题. Hierarchical conception reduces the scale of circuit design and decreases design complexity. Considering the vertical via assignment in the placement phase is another contribution. It helps simplify 3D problem to 2D problem, and make a good route planning for the router. Hungarian approximation method and neighborhood search method are used for vertical via assignment. Some test cases show that the integration of hierarchical 3D placement algorithm and vertical via assignment is efficient for 3D mixed-mode placement.
作者 闫海霞 李卓远 周强 洪先龙
机构地区 清华大学计算机科学与技术系
出处 《计算机辅助设计与图形学学报》 EI CSCD 北大核心 2007年第10期1235-1240,共6页 Journal of Computer-Aided Design & Computer Graphics
基金 国家"八六三"高技术研究发展计划(2004AA1Z1460) 国家自然科学基金(90407005 60476014)
关键词 三维 混合模式 布局 垂直通孔 3D mixed-mode placement ~ vertical via
分类号 TP302.1 [自动化与计算机技术—计算机系统结构]
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参考文献12

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二级参考文献11

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计算机辅助设计与图形学学报
2007年 第10期

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