摘要
综述了聚合物基电子封装材料的基本性能要求并分析了其影响因素,阐述了聚合物基电子封装材料的复合原理和结构设计思想,展望了聚合物基电子封装材料的发展趋势。
The performance requirements of polymer composite for electronic packaging are summarized and the factors that influence the properties of the composites is discussed in this paper. Composite principles and structure design of polymer composite for electronic packaging are expounded and the development tendency is forecast.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2007年第5期4-7,共4页
Aerospace Materials & Technology
基金
深圳大学科研启动基金资助(200615)
关键词
聚合物基复合材料
电子封装
热导率
Polymer composite, Electronic packaging ,Thermal conductivity
