MCM多层导体板频率响应的平面电路分析方法

A Method for Multiple Conductive Plane Frequency Response of Multichip Module Using Planar Circuit

MCM电源分配系统设计要求全频带目标阻抗维持在较小的范围内,使得瞬变电流不会引发过大的电压噪声。本文利用平面电路分析方法建立了MCM叠层多端口等效电路,并在此基础上推导了MCM多层导体板多端口阻抗频率响应,该方法在满足趋肤效应假设前提下对于高速数字系统是行之有效的。分别利用平面电路分析方法与传输矩阵方法计算了多层导体板MCM叠层端口自阻抗与互阻抗,计算结果得到了较为一致的吻合,从而验证了该方法的合理性。

The power distribution system in muhichip module （MCM） should be designed to have a low impedance over the entire bandwidth of the signal so that the transient current do not cause excess voltage noise. In this paper, the MCM stack-plane multiport equivalent circuit is proposed and the multiple conductive plane multiport impedance frequency response is deduced using the method of planar circuit. This method is suitable for high speed digital systems where skin effect approximation is valid. The multiple conductive plane multiport self-impedance and trans - impedance are computed using the planar circuit method and transmission matrix method, respectively. The numerical computation results show good correlation so that the proposed method is validated.