摘要
通过实例介绍了低介电常数、低CTE、高Tg印制电路板基材的制法。
This paper introduces the manufacturing methods of the low dielectric constant low CTE and high Tg printed circuit board base material through the medium of some experimental examples.
出处
《覆铜板资讯》
2007年第5期31-34,共4页
Copper Clad Laminate Information
关键词
介电常数
热膨胀系数
玻璃化温度
印制电路板
双酚AF
增韧
Dielectric constant
Coefficient of thermal expansion
Glass transition temperature
Printed circuit board
Bisphenol-AF
Toughening
