薄夹层界面热弛豫解及其在冲击温度研究中的意义

THERMAL RELAXATION AT THIN LAYER INTERFACES: ITS SIGNIFICANCE TO SHOCK TEMPERATURE STUDY

对样品／薄夹层／窗口组成的三层介质双界面热传导问题进行求解。在三个不同初温、不同热物性参数及边界条件下，获得了夹层介质中的温度解，给出了界面温度历史随薄层厚度、热扩散系数和介质之间热扩散系数之比的变化规律。从理论分析和实验结果发现，当夹层厚度小于１μｍ，热扩散系数大于１０－４ｍ２／ｓ时，在实验观测的时间内，界面温度历史将很快衰减到一平台，其幅度只由样品、窗口的初温和热扩散系数确定，而与夹层介质的初温。

The thermal conduction problem of two interfaces for a sample/thin layer/window configuration is solved for different initial temperature distribution,material thermal properties and different boundary conditions.Results reveal that the interface temperature history decreases sharply at first then approaches to a plateau within the observational time if the thickness of the thin layer is very small (less than 1mm)and the thermal diffusion coefficient is very large (greater than 10 -4 m 2/s).The amplitude of the temperature plateau depends on the initial temperature and the thermal diffusion coefficients of the sample or the window,does not relate to those of the thin layer.