干膜粘贴促进剂ST-10^+的研制

Research on Adhesion Promoter ST-10^+ for Dry Film

本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。这种处理剂以双氧水/硫酸为基础,配以特殊的微观结构调整剂,能在铜面形成均匀粗化的微表面,提高了铜面的表面积,从而促进了干膜与铜面的粘合,提高了超细线路产品的制作良品率。

This paper introduced a new copper treatment agent ST-10^＋ for improving the adhesion of dry film to printed circuit board copper substrate. This agent based on hydrogen peroxide/sulfuric acid and the addition of special microstructure modifiers allowed the controlled creation of uniform roughened copper surface. This agent could increase copper surface and promote dry film bonding, thus improved ultra fine-line product quality and yields.