硬盘盘片结构特点及NiP基板CMP研究

Structure Feature of the Hard Disc Slice and Research on the CMP of NiP Basic Substrate

分析了硬盘盘片的结构特点及硬盘基板的作用。在超净实验室中,通过调节氧化剂的含量,对硬盘基板进行了化学机械抛光。分析了不同氧化剂的含量对硬盘基板抛光速率的影响。对抛光后的硬盘基板进行了检测。抛光后的硬盘基板的粗糙度基本达到厂家的要求。对有可能造成硬盘基板划伤的原因进行了分析研究,为下一步解决划伤问题的实验提供了理论依据。

The structure feature of the hard disc slice and the effect of the basic substrate of the hard disc were analysed.Based on the experiment on adjusting the oxidizer,chemical mechanical polishing（CMP）was made on the basic substrate of the hard disc in the extraordinarily clean lab.The effect of various kinds of oxidizer content on the polishing velocity of the basic substrate of the hard disc was analysed.The detection on the polished basic substrate of the hard disc was made.The roughness of the polished basic substrate of the hard disc has achived the requirement of the user.Analysis and study were made on the potential cause of the nick on the basic substrate of the hard disc,which provided theoretics on solving the problem of nick.