摘要
分析了Kovar合金与K4玻璃阳极焊的结合机理和主要工艺参数对连接过程的影响,提出了金属与玻璃的连接机理为电场和温度场作用下的离子迁移、复合氧化物过渡层的生成和沉积,电压、温度、压力及试样表面质量是影响离子迁移和结合的主要因素,相匹配的热膨胀系数是防止开裂保证良好连接的必要条件。
The anodic bonding mechanism between Kovar alloy and K4glass is analyzed and the effects of main technology parameters on bonding process are discussed. It is put forward that ionic migration, creation and deposition of composite oxides under certain temperature and electric field result in good bonding between Kovar alloy and K4 glass. Voltage, temperature, pressure and surface quality of specimen are main factors which affect the ions migration and bonding quality. Suited thermal expansion coefficients is the necessary conditions for preventing cracking and good bonding.
出处
《西安科技大学学报》
CAS
北大核心
2007年第3期427-430,共4页
Journal of Xi’an University of Science and Technology
关键词
阳极焊
连接机理
离子迁移
anodic bonding
bonding mechanism
ionic migration
