摘要
通过对板级立体组装的侧板垂直互联技术进行研究,找到了板级垂直互联的一种可靠的理论途径,很好地解决了板间垂直互联的问题,实现了板级立体组装的侧板垂直互联工艺技术。
By the research on the side vertical inter - connected technology of 3 D assemble based on PCB, a reliable theoretic approach about PCB vertical inter- connected is found to solve vertical inter- connect problems between boards. Side vertical inter - connected process technology of 3D assembly based on PCB is achieved.
出处
《电讯技术》
2007年第5期174-176,共3页
Telecommunication Engineering
关键词
武器平台
立体组装
侧板垂直互联
焊点形态
weapon platform
3 D assembly
side vertical inter - connected
solder joint shape
