摘要
以聚醚多元醇、有机硅低聚物(PDMS)、二苯基甲烷二异氰酸酯(MDI)为主要原料,苯胺甲基三乙氧基硅烷(ND-42)及氨丙基三乙氧基硅烷(KH-550)为封端剂,制备了一系列湿固化的聚氨酯/有机硅(PU/PDMS)嵌段共聚物,并对其热稳定性、表面性能、力学性能及介电性能进行了测试和表征.结果表明,所制备的聚氨酯/有机硅嵌段共聚物具有良好的热稳定性和表面疏水性,介电性能也得到了很大的提高,而力学性能基本得到保持.
Moisture-curing polyurethane/polysiloxane （PUSR） copolymers were prepared based on polyether diol, polydimethylsiloxane （PDMS） and 4, 4t-diphenlymethane diisocyanate （MDI）. 3-aminopropyl- trimethoxysilane （KH-550） and Aniline-methyl- triethoxysilane （ND-42） were used as the end-capping agent. The thermal stability, mechanical properties, surface and dielectric properties of the polymers were analyzed and characterized. The results show that the thermal stability, dielectric and hydrophobic properties of the PUSR copolymers are greatly improved in contrast with pure polyurethan, while the mechanical property is almost unchanged.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2007年第10期1679-1682,共4页
Journal of Shanghai Jiaotong University
关键词
聚氨酯
有机硅
嵌段共聚
微相分离
polyurethane
organosiloxane
copolymerization
micro-phase separation
