摘要
A red-light AIGalnP light emitting diode （LED） is fabricated by using direct wafer bonding technology. Taking N-GaN wafer as the transparent substrate, the red-light LED is flip-chiped onto a structured silicon submount. Electronic luminance （EL） test reveals that the luminance flux is 130% higher than that of the conventional LED made from the same LED wafer. Current-voltage （I- V） measurement indicates that the bonding processes do not impact the electrical property of AIGalnP LED in the small voltage region （V 〈 1.5 V）. In the large voltage region （V 〉 1.5 V）, the I-V characteristic exhibits space-charge-limited currents characteristic due to the p-GaAs/n-GaN bonding interface.
A red-light AIGalnP light emitting diode （LED） is fabricated by using direct wafer bonding technology. Taking N-GaN wafer as the transparent substrate, the red-light LED is flip-chiped onto a structured silicon submount. Electronic luminance （EL） test reveals that the luminance flux is 130% higher than that of the conventional LED made from the same LED wafer. Current-voltage （I- V） measurement indicates that the bonding processes do not impact the electrical property of AIGalnP LED in the small voltage region （V 〈 1.5 V）. In the large voltage region （V 〉 1.5 V）, the I-V characteristic exhibits space-charge-limited currents characteristic due to the p-GaAs/n-GaN bonding interface.
基金
Supported by the National Basic Research Program of China under Grant No 2006CB604902, the National High Technology Research and Development Program of China under Grant No 2006AA03A121 the National Natural Science Foundation of China under Grant No 60506012, the Fok Ying Tong Foundation under Grant No 101062, the Beijing Municipal Commission of Education （KZ200510005003, 05002015200504）, and the Excellent PhD Thesis Foundation of High Education of China （200542）.
