温度敏感的金膜表面的制备及表征

Preparation of poly(N-isopropylacrylamide)modified gold film and the thermosensitive properties

该文将羧基化聚N-异丙基丙烯酰胺(PNIPAm)修饰在金膜上,得到了对温度敏感的表面,并利用表面等离子体共振传感器及视频接触角测量仪对其进行了表征。结果发现:羧基化PNIPAm分子修饰后的金膜表面共振波长峰位发生了10.3nm的红移,同时在26～35℃之间,其接触角有8°的变化,表明PNIPAm修饰的金膜表面对温度敏感。这样的表面有望用于生物芯片等领域,实现细胞、蛋白质等的可控捕获和释放。

The thermosensitive surface was obtained by modifying gold film with carboxyl-poly(N-isopropylacrylamide)(carboxyl-PNIPAm),and then the characteristic of such surface was investigated by SPR sensor and drop shape analyzer.The results showed that there was a clear red shift of 10.3 nm in resonance wavelength and a contact angle change of 8°from 26 ℃to 35 ℃.It was suggested that the PNIPAm modified gold film had thermosensitive properties and was expected to be used in biochips for capturing/releasing proteins,cells,etc.