摘要
Mo-Cu合金具有高的热导率和低的线胀系数,被广泛用作热深材料和电子封装材料。本文综述了Mo-Cu合金的基本性能、制备方法、应用和国内外的最新研究进展,概述了其致密化方法,并对其目前存在的问题进行了探讨。
Mo-Cu alloy of high thermal conductivity and low thermal expansion coefficient is widely used as electrical packaging material and heat sink material. The properties, fabricating methods, application and development of Mo-Cu alloy are described. The process of densification is summarized. The problems in production are discussed.
出处
《粉末冶金工业》
CAS
北大核心
2007年第5期40-45,共6页
Powder Metallurgy Industry
