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塑封球栅阵列焊点在温度循环下可靠性数值模拟

Numerical Simulation of Reliability of PBGA Solders under Thermal Cycling
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摘要 根据实际封装器件建立了三维有限元分析模型,模拟了PBGA焊点在温度循环载荷下的蠕变应变,比较了95.5Sn-3.8Ag-0.7Cu和63Sn-37Pb两种焊料形成的焊点在温度循环下的蠕变情况,预测了焊点在温度循环下的疲劳寿命,评价了两种焊点在温度循环条件下的可靠性.结果表明,两种焊点相比较,63Sn-37Pb焊点在循环中的蠕变现象更为显著,95.5Sn-3.8Ag- 0.7Cu焊点的疲劳寿命更长,可靠性更高. 3 - D Finite Element mold is generated according to actual package product. The creep strain of PB- GA （ plastic ball grid array） solder joints under temperature loading is simulated. 95.5Sn - 3.8Ag - 0. 7Cu and 63Sn -37Pb are taken as two kinds of solder to be compared in this study. The creep strain, low cycle life and reliability of both solders are analyzed. The results show that 63Sn - 37Pb solders joint creep more seriously in the cycling process. And 95.5Sn -3.8Ag -0. 7Cu solders have longer fatigue life, and a higher reliability under thermal cycling.
作者 刘洋 孙凤莲 王丽凤
机构地区 哈尔滨理工大学材料科学与工程学院
出处 《哈尔滨理工大学学报》 CAS 2007年第5期84-86,90,共4页 Journal of Harbin University of Science and Technology
基金 国家自然基金项目(50575060) 哈尔滨市科技创新人才专项基金项目(2006RFQXG047).
关键词 PBGA 焊点 蠕变 可靠性 数值模拟 PBGA solder creep reliability numerical simulation
分类号 TG405 [金属学及工艺—焊接]
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参考文献8

  • 1RICKY S W,DENNIS L Computational Model Validation with Experimenal Data fiom Temperature Cycling Tests of PBGA Assemblies for the Analysis of Board Level Solder Joint Reliability[C].5th.Int.Conf.on Thermal and Electronic and Micro-Systems,EuroSimE.2004:115-120.
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二级参考文献8

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共引文献3

哈尔滨理工大学学报
2007年 第5期

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