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超声波磁流变复合抛光中几种工艺参数对材料去除率的影响 被引量:17

Effect of several processing parameters on material removal ratio in ultrasonic-magnetorheological compound finishing
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摘要 提出了一种光学抛光的新方法——超声波磁流变复合抛光。介绍了该抛光方法的基本原理和实验装置,进行了超声波磁流变复合抛光实验,采用轮廓仪实测了光学玻璃超声波磁流变抛光材料去除轮廓曲线。通过该项工艺实验,研究了五种工艺参数(磁场强度、超声振幅、抛光工具头与工件的间隙、抛光工具头转速、工件转速)对光学玻璃材料去除率的影响。在一定实验条件下,获得的材料去除率为0.139μm/min,并获得了超声波磁流变复合抛光工艺参数与材料去除率的关系曲线,得出了光学玻璃超声波磁流变复合抛光的材料去除规律。 A new optical polishing method for aspheric surface, Ultrasonic-Magnetorheological Compound finishing (UMC finishing), is presented. The machining principle and the experimental procedure of UMC finishing are introduced. Then the material removal profile for optical glass in UMC finishing is measured by a profile meter (Form Talysurf PGI 1240), and the material removal ratio in UMC finishing is calculated. The effect of several processing parameters (magnetic flux density, ultrasonic vibration amplitude, minimum gap between polishing head and workpiece, rotational speed of polishing head and rotational speed of workpiece) on the material removal ratio for optical glass in UMC finishing is researched. The results show that the material removal ratio in UMC finishing is 0. 139 μm/min under some experimental conditions. The rules of material removal ratio for optical glass in UMC finishing are obtained,which provides a foundation for further:research of UMC finishing technology.
出处 《光学精密工程》 EI CAS CSCD 北大核心 2007年第10期1583-1588,共6页 Optics and Precision Engineering
基金 国家自然科学基金资助项目(No.50575059) 高等学校博士点专项基金资助项目(No.20050213040)
关键词 材料去除率 超声波磁流变复合抛光 超声波抛光 磁流变抛光 超精密加工 material removal ratio ultrasonic-magnetorheological compound finishing ultrasonic polishing magnetorheological finishing ultraprecision machining
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参考文献10

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二级参考文献22

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