摘要
本文提出了一种基于MEMS的LED芯片封装技术,利用体硅工艺在硅基上形成的凹槽作为封装LED芯片的反射腔。分析了反射腔对LED的发光强度和光束性能的影响,分析结果表明该反射腔可以提高芯片的发光效率和光束性能;讨论了反射腔的结构参数与芯片发光效率之间的关系。最后设计了封装的工艺流程。利用该封装结构可以降低芯片的封装尺寸,提高器件的发光效率和散热特性。
One package method of LED chip based on MEMS technology is proposed, a reflector formed by bulk silicon etching is used for LED chip. The influence of such reflector on LED＇s optical intensity and optical divergence is analyzed, also the relationship of the reflector＇s structure with LED＇s light intensity is induced. Finally the package art is designed.
出处
《激光杂志》
CAS
CSCD
北大核心
2007年第5期76-77,共2页
Laser Journal
