摘要
倒装芯片中凸点用于实现芯片和基板的电路互连,芯片凸点的制作是倒装芯片技术的关键技术之一。对金球凸点制作进行了介绍。金球凸点直接粘附于芯片上,同时又可具有电路互连的作用,可以完成倒装芯片与基板的电气连接。金球凸点的优势是简单、灵活、便捷、低成本,最大特点是无需凸点下金属层(UBM),可对任意大小的单个芯片进行凸点制作,平整度可达到±4μm。
Stud bumps are used for interconnection between chips and substrate in flip chips. The fabrication of chip bumps is a key process of flip chip technology. The process of gold stud bumps was introduced. The gold stud bumps were directly bonded on the chips with electronically connected the flip chips with the substrate. The advantages of gold stud bumps are simple, flexible, convenient and low cost. The main feature is that gold stud bumps can be fabricated on different sizes chips without UBM （under bump metallization）. The flatness can be controlled in ±4 μm.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第11期926-928,共3页
Semiconductor Technology
