摘要
提出了一种新型电流叠加型温度补偿技术,设计出用于AC/DC开关电源芯片的温度补偿电流源。在传统正负温度系数电流叠加的基础上,通过增加一条电流支路,对温度特性进行优化,使用简单的结构得到了很好的温度特性和电源电压调整率。使用XFAB公司的0.6μmCMOS工艺模型,Cadence模拟验证结果表明,在-40-135℃范围内温度系数为16×10^-6/℃。该方案已经应用于AC/DC开关电源芯片。
A novel temperature compensation technology of current superposition was presented and used for current reference in the AC/DC power supply IC. Compared with the typical current superposition with positive/negative temperature coefficient, the third current branch was added to optimize the temperature features by curvature compensation. The technology was utilized to obtain good temperature coefficient and line regulation with simple circuit structure. Based on XFAB 0.6 μm CMOS process model, the results of simulation in Cadence indicate that the current reference has a temperature coefficient of 16 × 10^-6/℃ at - 40 ℃ to 135 ℃. This solution is implemented into the AC/DC power supply IC.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第11期980-983,共4页
Semiconductor Technology
关键词
温度补偿
电流叠加型
正负温度系数
temperature compensation
current superposition
positive/negative temperature coefficient