期刊文献+

Au-Ag-Si系钎料合金与Ni的润湿性 被引量:8

Wettability of Au-Ag-Si brazing filler metal series with Ni
下载PDF
导出
摘要 通过分析相图,采用中频感应真空熔炼制成液相点温度在450~500℃之间Au-10.22Ag-3.25Si, Au-14.02Ag-3.28Si和Au-18.47Ag-3.27Si 3种不同成分的Au-Ag-Si系钎料合金。分别在其液相点以上20,40和60℃及流动氢气保护下进行钎料在Ni板上的铺展试验,通过分析铺展面积及润湿角,研究其与Ni的润湿性;采用背散射电子相观察钎料与Ni润湿后的界面组织。研究结果表明:Au-Ag-Si系钎料合金与Ni润湿性良好,随着钎焊温度的增加,铺展面积增加,浸润角减小;钎料合金与Ni润湿后,出现润湿环现象;润湿环主要由Au元素组成;钎料与Ni润湿后,在界面处形成Ni3Si金属间化合物,Ni3Si的形成在一定程度上可提高钎料焊接强度。 Based on the phase diagram, three kinds of Au-Ag-Si brazing filler metal with three different constituents, i.e., Au- 10.22Ag-3.25Si, Au- 14.02Ag-3.28Si and Au- 18.47Ag-3.27Si were prepared by using the vacuum melting method in a medium-frequency induction furnace. The spreading-out experiment of the Au-Ag-Si brazing filler metal on Ni sheet was done at 20, 40 and 60 ℃ above its liquidus temperature respectively with flow H2 as protective gas. The wettability of the Au-Ag-Si brazing filler metal with Ni was studied by measuring and analyzing the area-of-spread and wetting angle. The interface structure of the brazing filler metal with Ni after its spreading was observed by backscattered electron images. The results show that the Au-Ag-Si brazing filler metal series have a good wettability with Ni. When brazing temperature increases, the area-of-spread increases and the wetting angle decreases, there are wetting rings when brazing filter metal is wetted with Ni. The wetting rings principlely consist of Au element. The intermetallic of Ni3Si is formed at the interface, and the formation of Ni3Si can improve the brazed joint strength to some degree.
出处 《中南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2007年第1期36-40,共5页 Journal of Central South University:Science and Technology
基金 国家高新工程重点项目(DZ-2002-021)
关键词 Au-Ag-Si 钎料 润湿性 润湿环 NI3SI Au-Ag-Si brazing filler metal wettability wetting ring NiaSi
  • 相关文献

参考文献12

  • 1黄伯云,李成功,石力开,等.中国材料工程大典[M].北京:化学工业出版社,2006.
  • 2莫文剑,王志法,王海山,杨会娟.Au-Ag-Si钎料合金的初步研究[J].贵金属,2004,25(4):45-51. 被引量:20
  • 3莫文剑,王志法,姜国圣,王海山.Au-Ag-Si新型中温共晶钎料的研究[J].稀有金属材料与工程,2005,34(3):497-500. 被引量:19
  • 4Batra N K,See J B,King T B.Flux reactions in soldering[J].Welding Journal,1974,53:10.
  • 5ZHUANG Hong-shou.High temperature brazing[M].Beijing:National Defence Industry Press,1989:121-123.
  • 6Shieu F S,Chen C F,Sheen J G,et al.Intermetallic phase formation and shear strength of a Au-In microjoint[J].Thin Solid Films,1999,346:125-129.
  • 7LIU Xing-sheng,XU Shuang-yan,LU Guo-quan,et al.Stacked solder bumping technology for improved solder joint reliability[J].Microelectronics Reliability,2001,41:1979-1992.
  • 8Hosking F M,Stephensand J J,Rejent J A.Intermediate temperature joining of dissimilar metals[J].Welding Research,1999,4(Suppl):127.
  • 9吴文云,邱小明,殷世强,孙大谦,李明高.Bi、Ag对Sn-Zn无铅钎料性能与组织的影响[J].中国有色金属学报,2006,16(1):158-163. 被引量:29
  • 10王烨,黄继华,张建纲,齐丽华.Sn-3.5Ag-0.5Cu/Cu界面的显微结构[J].中国有色金属学报,2006,16(3):495-499. 被引量:17

二级参考文献54

共引文献109

同被引文献91

引证文献8

二级引证文献25

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部