摘要
采用聚氨酯预聚体、扩链剂和交联剂对TDE-85/甲基四氢邻苯二甲酸酐(MeTHPA)树脂进行改性,通过红外光谱和示差扫描量热法(DSC)分析,探讨聚氨酯(PU)改性TDE-85/MeTHPA树脂体系固化反应。研究表明:固化反应的表观活化能由TDE-85/MeTHPA树脂体系的83.14 kJ/mol降至PU改性TDE-85/MeTHPA树脂体系的67.91 kJ/mol。确定的PU改性TDE-85/MeTHPA树脂体系合适的固化工艺条件为:120℃,2 h+140℃,2 h+160℃,2 h。在该固化工艺制度条件下,PU改性TDE-85/MeTHPA体系固化反应完全,能满足固化工艺要求。
The TDE-85/Me HPA resin was modified by chain-extended reagent, crosslink agent and polyurethane prepolymer. The curing reaction of the TDE-85/Me HPA resin modified by polyurethane was discussed by DSC and FT-IR. The results show that the apparent activation energy of the curing reaction is reduced from 83.14 kJ/mol for the TDE-85/ MeTHPA system to 67.91kJ/mol for the PU modified TDE-85/MeTHPA system. The appropriate curing technology ofTDE-85/Me HPA resin modified by polyurethane is determined as 120℃, 2 h＋140 ℃, 2 h＋160℃, 2 h. The TDE-85/MeTHPA resin is modified by polyurethane cures perfectly under this curing condition.
出处
《中南大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2007年第2期213-217,共5页
Journal of Central South University:Science and Technology
基金
国家新材料攻关项目
关键词
聚氨酯
环氧树脂
互穿聚合物网络
固化反应
polyurethane
epoxy resin
interpenetrating polymer network
curing reaction
