微槽冷却热沉结构尺寸的优化设计

Optimization design of structural size of microchannel cooling heat sink

以热阻和压降作为2个目标函数建立了微槽冷却热沉的多目标优化模型,采用序列二次规划(SQP)方法对微槽的结构尺寸进行了优化设计。优化结果表明:微槽冷却热沉的结构形状对传热性能有很大的影响,与三角形和梯形结构相比,矩形微槽结构的传热效率更高。给出了2种加权系数情况下的优化尺寸,相应的微槽宽度分别为130μm和120μm,槽栅的宽度分别为176μm和350μm,微槽的高度分别为640μm和1000μm,相应的热阻分别为0.4857K/W和0.5094 K/W。对以上得到的优化结构的微槽冷却热沉的流体流动和传热进行了数值模拟,得到芯片的最高温度分别为358.34 K和361.52 K,完全可以满足工作芯片对温度的要求。

Aiming at the thermal resistance and pressure drop as two objective functions, the multiobjective optimization model of the microchannel cooling heat sink was built. The sequential quadratic programming （SQP） method was used to optimize the structural sizes of microchannel. The optimization results show that the thermal transfer performance of microchannel cooling heat sinks is affected intensively by their structural shape, and compared with triangle and trapezoid shape, rectangle structure has better thermal transfer performance. Two sets of optimized sizes under two sets of different weighting coefficients were given, and the corresponding width of channel were 130 and 120 μm, and fin width were 176 and 350 μm, and height were 640 and 1000 μm, and the thermal resistance were 0. 4857 and 0. 5094 K/W, respectively. The numerical simulation of the fluid flow and the thermal transfer of the above optimized structure shows that the highest temperatures of chips were 358. 34 and 361. 52 K, respectively, meeting the requirement of the chip for the work temperature.