合金薄膜铜衬底抛光质量对薄膜表面结构的影响

Effect of polished surface on the structure of alloy film with copper substrate

合金薄膜具有良好的导电性、抗磨损性质,已成为半导体产业的技术热点。铜做为合金薄膜衬底材料时,要求其有完美的表面。本文采用氧化铝微粉和金刚石抛光膏对合金薄膜铜衬底进行了机械研磨和抛光的实验研究,采用接触式粗糙度仪、AFM、台阶仪和光学显微镜对比分析了铜衬底表面粗糙度、表面均匀性和平面度的变化规律。初步探讨了铜衬底表面对Pd-Ni-P合金薄膜表面结构的影响,研究结果表明采用1μm平面度,Ra小于3 nm且抛光均匀性好的光滑铜衬底可以获得良好的合金薄膜。

Alloy filming becomes the key technology of semiconductor for its good heat conductivity and wear performances. Copper, as one of the substrate materials, should have a perfect surface with polishing process. Experiments of mechanical lapping with A12 03 powders and polishing with diamond powders for copper substrate were conducted in this paper. Uniformity, roughness and flatness were analysed by contacted roughness, AFM measurements method and microscopes. Alloy films surface was measured to study the effect of surface integrity on the structure of Pd-Ni-P alloy films. Good surface of alloy films could be obtained on a polished surface with 1 micron flatness and surface roughness Ra less than 3nm with good uniformity.