利用激光微敷电子胶(LMCEP)在绝缘基板上直接制造电子元件

Direct Fabrication of Electronic Components on Insulated Boards by Laser Microcladding Electronic Pastes(LMCEP)

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摘要概述了利用激光微敷电子胶(LMCEP)在玻璃、陶瓷和有机层压板之类的绝缘基板上直接制造电子元件和导线的新方法。采用计算机辅助设计/计算机辅助制造(CAD/CAM)能力和无须掩模的这种技术,成功地制造了具有不同图形的导电性金属线和电阻器。 This paper describes a novel method to fabricate the electronic components diretly on insulating boards such as glass, ceramics,and organic laminated boards by laser microcladding electronic pastes（LMCEP）. With computer-aided design/computer aided manufacturing （CAD/CAM） capability and this technique without mask, the conductive metal lines and resisitors with different patterus were fabricated successfully.

作者蔡积庆（编译）

机构地区江苏南京

出处《印制电路信息》 2007年第11期41-45,共5页 Printed Circuit Information

关键词电路板制造激光直接写入(LDW) 激光微敷电子胶(LMCEP) 银导体电子元件 circuit board fabrication laser direct writing（kDW） laser micro cladding electronic pastes silver conductors electrouic components

分类号 TN41 [电子电信—微电子学与固体电子学]

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利用激光微敷电子胶(LMCEP)在绝缘基板上直接制造电子元件

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