热阻网络模型在微槽冷却热沉优化设计中的应用

Application of thermal resistance net model in optimization design of microchannel cooling heat sink

基于热阻网络模型,以热阻和压降作为目标函数建立了微槽冷却热沉的多目标优化模型,采用序列二次规划(SQP)方法对微槽的结构尺寸进行了优化设计。对于冷却尺寸为L×W=6 mm×6 mm,功率为100 W的芯片的热沉,优化后微槽宽度和高度分别为120μm和815μm,相应地总热阻为0.413 K/W。对优化后的微槽冷却热沉采用计算流体动力学(CFD)方法进行了数值模拟。模拟结果与热阻网络模型预测的结果吻合得很好。

Taking the thermal resistance and the pressure drop as objective functions, a multi-objective optimization model was proposed for the microchannd cooling heat sink based on the thermal resistance network model. The sequential quadratic programming procedure was used to do the optimization design of the structure size of the microchannel. For the heat sink to cool a chip with the sizes of L×W=6 mm×6 mm and the power of 100 W, the optimized width and height of the microchannel are 120 μm and 815 μm respectively, and its corresponding total thermal resistance is 0.413 K/W. The optimized microchannel heat sink was numerically simulated by a computational fluid-dynamics software, and its results agreed well with those predicted by the proposed model.