发光二极管无铅封装技术的研究

Study on lead-free packaging technology of LED

影响LED发光器件性能的主要因素是树脂的折射率、透光率、tg点、线性膨胀系数、与基材的粘合强度、吸水率等树脂特性,还要综合考虑原料成本和生产过程工艺控制等问题。针对以上因素,研究了LED发光器件在封装过程中的一些关键技术问题,以期在保证产品可靠性的前提下进一步提高封装的成品率、发光效率以及降低封装成本。

The main factors influencing the performance of LED device are refractive index of the resin,light transmittance,tg point,linear coefficient of expansion,adhesion strength with substrate,and water absorption rate.In view of the above factors,some key technique problems of LED device in the packaging process were studied,in order to increase the yield,luminous efficiency and reduce the package cost.