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中温热熔预浸料用环氧树脂胶膜配方的研究 被引量:13

INVESTIGATION OF EPOXY RESIN FILM FORMULA FOR MODERATE-TEMPERATURE HOT-MELT PREPREG
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摘要 本文通过研究环氧树脂各配方体系的成膜性、室温胶膜状态、动态DSC曲线特征以及体系的粘温特性,初步确定中温热熔膜浸法用树脂体系配方为固化剂/促进剂/环氧树脂的质量比为5-6/2-3/100。该质量比下,体系可中温固化,成膜性工艺性佳,室温胶膜韧性好,满足了热熔膜浸法制备预浸料的要求。 According to the film forming property, the resin film' s state ( in room temperature), DSC curves and the viscosity-temperature characteristics of epoxy matrix, the resin film system which was used as moderatetemperature hot-melt prereg has been designed. The formula involves curing agent/accelerator/epoxy resin with mass porportion of 5 - 6/2 - 3/100. This system can be cured at mid-temperature. With very exlellent film forming properties, the film was prepared with good toughness at room temperature, which could meet the requirements of moderate-temperature hot-melt prepreg.
出处 《玻璃钢/复合材料》 CAS CSCD 北大核心 2007年第6期9-13,共5页 Fiber Reinforced Plastics/Composites
关键词 预浸料 环氧树脂 树脂膜 热熔胶膜法 Prepreg Epoxy resin Resin film Hot-melt film method
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参考文献14

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